Last updated 2026-08-18
- Raised $11.4M Secondary led by iNPACK, Feb 2024
- Raised $2.5M Series A, Nov 2022
- Raised $987k Seed round, 2020
Total raised
$14.9M
Stage
—
Founded
2020
Headcount
—
HQ
Migdal HaEmek, Israel
Sector
Semiconductors
About
iNPACK, a subsidiary of PCB Technologies, specializes in System-in-Package (SiP) solutions, semiconductor packaging, organic substrates, and microelectronic assembly. They provide design, manufacturing, assembly, and testing services for various industries including aerospace, defense, medical, electronics, automotive, energy, and communications. iNPACK focuses on high-end technology for improved signal integrity and increased functionality, offering solutions for miniaturization and advanced packaging.
Funding history · 3 rounds · $14.9M total
2024-02
Secondary
$11.4M
★ iNPACK★ ATS Engineering★ PCB Technologies Ltd.HYPETechstars
2022-11
A Round
$2.5M
2020
Seed
$987K
Team · 1
Yaniv Meydar
CEO
Sectors & technology
Primary sector
Semiconductors
Technologies
Target customers
Business model
B2B
Full data — links, identifiers, deals & radar signals (jobs, patents, research, more)
External links
| Website | pcb-technologies.com/inpack/pcb-miniaturization |
|---|
Identifiers & details
| Founded | 2020 |
|---|