Micro Components · raw details

Semiconductor Packaging · Migdal HaEmek · Founded 1993

inactive Mature ← back to profile

Highlights

1 patent

About

Semiconductor Packaging

Micro Components (MCL) develops, licenses, and produces aluminum-based advanced multilayer substrates for the high-power electronics industry. The company seeks to improve the functionality and reduce the weight of a wide range of products, including high-power LED lighting, power boards for automotive components, and power RF boards. MCL has developed ALOX, a patent-protected multilayer substrate technology that aims to deliver better thermal management of high-power electronic modules and microelectronics packaging applications. The multilayered structure consists of a thermally conducting aluminum encompassed by electrically insulating anodized aluminum. The aluminum provides a direct metallic thermal path throughout the substrate, which is electrically isolated by the surrounding insulating anodized aluminum. This aluminum and aluminum oxide structure is cladded by high-resolution patterned copper layers on both sides, enabling the signal routing. Thermally blocking materials with suboptimal thermal conductivity and reliability are not used, making ALOX substrates well suited to the fabrication of substrates and high-power semiconductor devices and modules.

Identity

NameMicro Components
Slugmcl
Type / kindstartup
Source _idagxzfmlsbGlzdHNpdGVyGAsSC05ld19Db21wYW55GICAgN6YwMEIDA

Status

Statusinactive
Status reasonNon Active, May 2021 ceased to operate
Last update2026-05-17

Location

HQ country codeIL
HQ region/districtNorth District
HQ cityMigdal HaEmek
HQ addressHalavyan Street 4, Migdal HaEmek, Israel

Classifications

Primary sector Industrial Technologies
Sub-sectors
Industrial TechnologiesMaterial Innovations & ApplicationsEnergy TechEnergy Management & Grid Integration
Technologies
Materials & Substances
Target customers
Industrial ManufacturingDiscrete IndustriesSemiconductors & Electronics
Business models
B2B
Tags
electronic-manufacturingthermal-managementmaterialsnanotechnology

Funding

Total raised
Current stageMature

Raw source document

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