About
Semiconductor Wafer Dicing Equipment
Advanced Dicing Technologies (ADT) specializes in the development and manufacture of systems, blades, and processes used in the dicing of silicon-based package singulation and hard material microelectronic components. ADT offers dicing equipment with a variety of capabilities, configurations, and levels of automation, as well as peripheral instrumentation and accessories to suit a range of customer requirements.
Identity
| Name | Advanced Dicing Technologies |
|---|---|
| Slug | advanced-dicing-technologies-adt |
| Type / kind | startup |
| Source _id | agxzfmlsbGlzdHNpdGVyGAsSC05ld19Db21wYW55GICAgN7J0K4IDA |
Status
| Status | acquired |
|---|---|
| Status reason | Acquired by Neng Yang on Jul, 2019 |
| Last update | 2026-05-17 |
Location
| HQ country code | IL |
|---|---|
| HQ region/district | North District |
| HQ city | Yokne'am Illit |
| HQ address | HaMada Street 5, Yokne'am Ilit, Israel |
Web & social
| Website | https://www.adt-co.com |
|---|---|
| https://www.linkedin.com/company/75741108 |
Classifications
Primary sector Industrial Technologies
Sub-sectors
Industrial TechnologiesMicroelectronics & Photonics SolutionsManufacturing Processes & Systems
Technologies
Semiconductors & Electronics
Target customers
Industrial ManufacturingDiscrete IndustriesSemiconductors & Electronics
Business models
B2B
Tags
semiconductorsmachinerywaferselectronic-manufacturingoptronics
Funding
| Total raised | — |
|---|---|
| Current stage | Acquired |
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